top of page

Wafer Prober

8” & 12” Wafer Prober

Introducing our our state-of-the-art 8″ and 12″ wafer probers, setting the benchmark for precision and performance in semiconductor testing. Built on a robust solid granite base for unparalleled stability. OS6000 boast a sophisticated linear motor system that ensures swift and highly accurate positioning. The introduction of MicroTouch (soft touchdown) technology guarantees delicate yet precise wafer handling ensures delicate handling of wafers, safeguarding against potential damage.

The closed-loop system, coupled with our proprietary Active Vibration Control (AVC), a feature that mitigates any disturbances and vibration (external or internal), maintaining an utmost optimal testing environment. What sets our probers apart are the unique software features that elevate performance to new heights, offering intuitive control and unmatched flexibility. With a focus on innovation and reliability, our wafer probers redefine precision in semiconductor testing.

Group-5616-3.png

Specifications Overview

Screenshot 2025-07-18 at 9.31.56 AM.png

Vision Inspection

Post Seal Vision Inspection Handler Series

The osRRS series is designed with advanced key technologies to provide for Reel-to-Reel Inspection.

Osrrs-1.png

osRRS

(Single Camera)

osrrse-1.png

osRRSe
(Dual Camera)

Specifications Overview

Screenshot 2025-07-18 at 8.38.06 AM.png
Screenshot 2025-07-18 at 8.38.22 AM.png
Screenshot 2025-07-18 at 8.38.36 AM.png
Screenshot 2025-07-18 at 8.38.46 AM.png
Screenshot 2025-07-18 at 8.38.55 AM.png
Screenshot 2025-07-18 at 8.39.04 AM.png

Tray-based Vision Handler

Introducing Ocas Superior Tray-based Vision Handler which performs final inspection on various IC packages handled in tray.

Tray to Tray Series

osTTSe.png

osTTSe

osSTS-.png

osSTS

Specifications Overview

Screenshot 2025-07-18 at 9.48.34 AM.png
Screenshot 2025-07-18 at 9.48.50 AM.png

Wafer Based Vision Machine

osWIS 100: Wafer Vision Inspection Machine

osWIS 100 Wafer Vision Inspection Handler offers advanced solution for 2D surface defect inspections, measurements and multiple handling mechanisms to support different wafer forms including raw wafer, hoop ring, and framed wafer range from 120mm (6”) to 300mm (12”).

osWIS100.png

Specifications Overview

Screenshot 2025-07-18 at 9.53.53 AM.png
bottom of page