Meet the OS6000, OCAS Systems' flagship wafer prober designed to set new benchmarks in semiconductor testing. Built for both 8″ and 12″ wafers, this high-performance system combines stability, speed, and accuracy—all on a robust solid-granite base engineered for unparalleled vibration control.

​

Core Capabilities

​

1. Linear Motor Gantry System

​

• High-speed direct-drive linear motor enables rapid positioning

• Closed-loop control ensures exceptional repeatability and precision (±1.5 µm in XY, ±4 µm in Z).

 

 

2. MicroTouch Soft-Touchdown

​

Featuring soft-touchdown MicroTouch technology, the OS6000 delivers gentle yet accurate wafer handling—minimising probe and wafer damage while ensuring reliable contact.

 

3. Active Vibration Control (AVC)

​

This proprietary AVC system neutralises both internal and external vibrations, creating a stable testing environment that upholds metrology-grade precision ocassys.com+1ocassys.com+1.

 

4. Closed-Loop Positioning & Auto PTPA Updates

​

Continuous correction via real-time feedback maintains positional accuracy and ensures the prober remains in top alignment—critical for high-volume and high-resolution testing.

 

5. Wafer Handling & Transfer Automation

​

Equipped with an integrated transfer arm, the OS6000 automates wafer loading and unloading, enhancing throughput while reducing manual handling errors.

​

​

Technical Specifications

​

​

 

​

​

​

​

​

​

​

​

​

​

​

​

​

​

 

 

​​​​​​*Specifications are subject to change without prior notice

 

Field-Proven Features​

​​

Granite Base—The massive granite core dampens structural resonances and isolates the system from floor-borne disturbances.

Direct-Drive Gantry—Achieves faster acceleration and reduced mechanical backlash compared to traditional lead-screw systems.

Automated Wafer Handling—Minimises operator variation and maximises cycle throughput.
 

Predictable Maintenance—Closed-loop feedback systems support real-time diagnostics and predictive service strategies.

​

​